Brief Analysis of LED Chip High Power Mode and Heat Dissipation Method

For the LED light-emitting chip, with the same technology, the larger the power of a single LED, the lower the light efficiency, but the number of lamps used can be reduced, which is beneficial to save costs; the smaller the power of a single LED, the higher the light efficiency, but The number of LEDs required in each luminaire increases, the size of the lamp body increases, and the design difficulty of the optical lens increases, which adversely affects the light distribution curve. Based on the combination of factors, a single LED with a rated operating current of 350 mA and a power of 1 W is usually used.

At the same time, the packaging technology is also an important parameter affecting the light efficiency of the LED chip. The thermal resistance parameter of the LED light source directly reflects the packaging technology level. The better the heat dissipation technology, the lower the thermal resistance, the smaller the light decay, the higher the brightness of the lamp and the longer the life.

As far as the current technological achievements are concerned, the luminous flux of LED light sources can reach thousands or even tens of thousands of lumens, and a single LED chip cannot be achieved. In order to meet the demand for full illumination, light sources using multiple LED chips have been combined in one fixture to meet high-brightness illumination. By increasing the multi-chip size, improving LED luminous efficiency, adopting high-efficiency packaging and high current, high-brightness targets can be achieved.

There are two main types of heat dissipation for LED chips, namely heat conduction and heat convection. The heat dissipation structure of the LED lamp includes a substrate heat sink and a heat sink. The soaking plate can realize ultra-high heat flux heat transfer, which can solve the heat dissipation problem of high-power LED. The soaking plate is a vacuum chamber with a microstructure on the inner wall. When heat is transferred from the heat source to the evaporation zone, the working medium inside the cavity will generate liquid phase gasification in a low vacuum environment. The medium absorbs heat and expands rapidly, and the medium in the gas phase quickly fills the entire cavity. When the gas phase medium contacts a relatively cold area, condensation will occur, releasing the heat accumulated during evaporation, and the condensed liquid medium will return from the microstructure to the evaporation heat source.

The high-powering methods commonly used in LED chips are: large-scale chips, improved luminous efficiency, packaging with high light-receiving efficiency, and high current. In this way, although the amount of current luminescence will increase proportionally, the amount of heat generated will also increase. Instead of using a high thermal conductivity ceramic or metal resin package structure, it can solve the heat dissipation problem and strengthen the original electrical, optical and thermal characteristics. In order to increase the power of the LED lamp, the working current of the LED chip can be increased, and the direct method of increasing the working current is to increase the size of the LED chip. However, due to the increase of the working current, heat dissipation has become a crucial issue, and the heat dissipation problem can be solved by the improvement of the packaging method of the LED chip.

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