As printed circuit board technology has continued to evolve, it has paved the way for the creation of a host of exciting product innovations. A prime example is the development of the PCB for LED lighting. The LED is soldered to the circuit board and features a chip that produces the light when electrically connected. A thermal heat sink and a ceramic base are used to bond the chip.
PCB = printed circuit board and PCBA = printed circuit board assembly. For PCB, it means the copper circuits be printed on a board, and so the main composition of PCB are copper and board.
The copper is the circuits material and the circuits designed by the PCB designers. Depends on the current in the circuits, the PCB copper thickness could be done with 0.5oz-10oz. But the PCB designers need be noted that the copper track width/space need be enlarged with the thickness. For example, the minimum copper track width/space could be 3mil/3mil with 0.5oz, but would be 4mil/4mil with 1oz.
The PCB board could be rigid PCB, could be flex PCB and also could be Flex-Rigid PCB. And the materials could be FR4, PI, Aluminum, Copper-based, Rogers, Teflon, etc. They have different applications. For example, FR4 PCB is the most commonly used for rigid PCB and almost good for all electronics products; PI is the most commonly used for flex PCB; Aluminum and copper-based have good thermal diffusivity and always used for LED PCB ; Rogers PCB and Teflon PCB are always used for High Frequency PCB, etc.
We are the one-stop shop for all kinds of PCB manufacture service from PCB Prototype to big volume, which could save our customers a lot of time and money.
PCB Manufacture Capabilities
Features
Capabilities
Layers
1-36 layers
Material
FR-4, Aluminum, Copper, Polyimide, high frequency (Rogers, PTEE, PI), etc.
PCB Type
FR-4 Standard PCB , Aluminum PCB, Copper-based PCB, HDI PCB , Rigid-Flex PCB, Flex PCB, Thick Copper PCB and Rogers PCB, etc.
Board Thickness
0.1mm-6.0mm
Copper Thickness
1/2oz-6oz(18um-210um)
Biggest Board size
600mm*1200mm
Min Tracing/Spacing
0.075mm/0.075mm (3mil/3mil)
Min drilling Hole diameter
0.15mm(6mil), 0.1mm(4mil)-laser drill
Solder Mask
Green, Black, White, Red, Yellow, Blue and Purple, etc.
Silkscreen color
White, Blue, Black, Red, Yellow
Surface finish
HASL Lead free, Immersion Gold (ENIG), Immersion Tin, Immersion Silver, OSP, Carbon oil, etc.
Special Techniques
Impedance Control, Gold Fingers, Blind/Buried vias, Peelable solder mask, Half holes, Via-in-Pad and Countersink hole, etc.
PCB Products Show
PCB Factory Show
LED PCB LED PCB,LED PCB Board,Aluminum LED PCB Assembly,LED PCB Strip ZhongFeng Electronic Technology Co., Limited , https://www.dopcba.com
The second day of the G20-LED Summit (G20 LED Summit), which is known as the "LED industry wind vane", will be held the day before the conference (December 8, 2011). The theme of the 2nd meeting was “Competition in Competitionâ€. The leaders of 20 companies will focus on the current LED industry dilemma and market competition environment changes in a day, and seek to maximize the role and impact of the G20-LED Summit. Force, and through the cooperation between G20 companies to jointly resolve the crisis. See: http://
After the baptism of the 1st meeting of the G20-LED Summit in August, the G20 companies reached a consensus and finally formed the "G20-LED Summit Shanghai Communiqué" (for details, please see: http:// Asdisp2-65b095fb-37761-.html). The 2nd meeting will discuss the specific implementation plan for the patents, markets, product specifications and other initiatives in the G20-LED Summit Shanghai Communiqué.
In addition, in order to promote the friendship between the leaders of G20 member companies and promote business exchanges and cooperation, the organizing committee of this conference held the “G20-LED Summit Member Golf Friendly Match†in Guanlan Lake, Shenzhen on the day before the meeting (December 7). The member company leaders will collapse on December 6th to the hotel specially arranged by the organizing committee.
The 2011 High-tech LED Conference will be held on December 9-10, 2011 (Friday, Saturday). This year's conference will not only continue to invite well-known experts at home and abroad to share the leading edge of LED technology trends, but also significantly increase the number of engineers. The prize money of the Grand Prix has enriched the annual awards; and specially added the technical and marketing brainstorming sessions, and invited you to enjoy the feast of ideas brought by the technology and marketing elites. The agenda is available at: http://
At this annual event, the organizing committee has arranged the performances as usual, and the performances and various awards ceremonies (annual awards, papers and product design competition awards) are interspersed to cheer for the LED industry. In addition, the evening will draw three winners from the participants (the prize: Apple Ipad2). The party program is known in advance, see: http://
Judging from the current registration situation, this year's conference continues the enthusiasm of last year. The number of places is now low. Here, Gaogong LED reminds you that friends who want to attend the conference should contact us as soon as possible. Sign up to reduce unnecessary troubles caused by your registration on the spot and ensure on-time admission. To register online, please click: http://
For more information about the 2011 Senior Industry Annual Conference, please visit the official website: http:// 
An LED PCB Board tends to generate a high volume of heat, making it difficult to cool via traditional means. Consequently, metal core PCBs are frequently chosen for LED application due to their enhanced ability to dissipate heat. Aluminum in particular is often used to manufacture circuit boards for LED lights. The Aluminum PCB typically includes a thin layer of thermally conductive dielectric material that can transfer and dissipate the heat with much greater efficiency than a traditional rigid PCB.
2011 Gaogong LED annual event is ready to go
[High-tech LED News] 2011 High-tech LED Annual Event 2011 High-tech LED Conference (Annual Awards, Papers and Product Design Competition Awards, Industry and Investment Forum) will be launched on December 9-10, 2011 (Friday, Saturday) The preparatory work for the Qinghai World in Shenzhen is progressing smoothly and is now nearing completion.